Zarlink Advanced Packaging | Services

Packaging Technologies

Packaging technologies include hermetic die packaging, flip chip and optical module assembly Zarlink Advanced Packaging specialises in the custom design and manufacture of electronic packaging and supports all major technologies, including:

  • Hermetic die packaging
  • Flip chip
  • SIP (system-in-a-package)
  • RF PCB and BGA modules
  • Die stacking
  • Flexible substrates
  • Optical module assembly

Design Expertise

  • Analogue, digital, RF and antenna circuit design
  • Design integrity—modelling, simulation and FMEA
  • Design verification—test system design and implementation
  • Commercial evaluation—design for manufacture and value engineering
  • Analysis and design documentation—3D CAD (Pro Engineer)
  • PCB and ceramic substrate design using latest PCB layout software
  • Rapid prototyping processes
  • Knowledge of worldwide medical and telecom standards

Manufacturing Capabilities

Zarlink's manufacturing capabilities include component and mixed signal electrical testing
  • Class 1000 clean rooms for medical micro assembly
  • SMT pick & place/reflow
  • Die placement
  • Wire bonding
  • Component test & marking
  • Mixed signal electrical test
  • Traceability back to individual silicon wafer number

Download Zarlink's Microelectronics Fact File or contact us to discuss how Zarlink's Advanced Packaging expertise can help you.